The resolution of CFD has been greatly improves compared to our existing models. The minimum flow of 1mL/shot offers greate accuracy in chemical condensation control that is required in the wafer cleaning process. The anti-siphon mechanism prevents unintentional siphoning.
Corrosion resistant wet ends
Fluoroplastic wet ends (PTFE, PFA, PTCFE) is capable of handling the strong acids, alkaline and hydrogen peroxide required for semiconductor processing. PFTE, PFA, PP, PVC external parts and PTFE coated screws provide additional protection against chemical attack.
Flow rate adjustment
Simply open the bottom cover to easily adjust stroke length to give between 1.0-2.7ml/shot. (Factory default is 1.0ml/shot)